PCB MAKE
PCB MAKE
| Processing capacity parameters of various processes | |||
| Comprehensive parameters | |||
| S.N. | Items | Process capability | |
| 1 | Surface treatment method | HASL/LF-HASL, Immersion Au, Ni/Pd/Au, OSP, Immersion Tin, Immersion silver, Light copper | |
| 2 | Selective surface treatment | Immersion Au +OSP, Immersion Au + gold finger (or called as "edge connector")， Immersion silver + gold finger (or called as "edge connector")， Immersion Tin + gold finger (or called as "edge connector"), HASL (hot air solder level) + gold finger (or called as "edge connector") | |
| 3 | Product manufacturing capacity | Maximum layers | 32 layers (≥20 layers; To be reviewed) |
| Maximum finished product size | 21.5*47.2inch (If it exceeds 30inch, it shall be reviewed) | ||
| Minimum finished product size | 10*10mm | ||
| Plate thickness capacity | 0.2~10mm(<0.2mm, >5mm; To be reviewed) | ||
| Warpage limit capacity | 0.2%%(≤0.5%%; To be reviewed) | ||
| Fabrication of blind hole plate by multiple pressing | Pressing of the same core plate ≤ 3 times (if it is pressed for three times, it needs to be reviewed) | ||
| Special tolerance requirements for plate thickness (no requirements for interlayer structure) | Finished plate thickness≤1.00mm, it can be controlled: ±0.075jmm | ||
| Finished plate thickness≤2.0mm, it can be controlled: ±0.1mm | |||
| Finished plate thickness: 2.0~3.0mm, it can be controlled: ±0.15mm | |||
| Finished plate thickness ≥3.0mm, it can be controlled: ±0.2mm | |||
| Minimum hole diameter | 0.15mm(<0.2mm; To be reviewed) | ||
| The ratio of the plate thickness to the hole diameter | 15:1(>12:1; To be reviewed) | ||
| Minimum inner-layer space capacity (unilateral) | 4 ~ 8 layers (including): sample: 4mil, small batch: 6mil | ||
| 8~12 layers (including): sample: 5mil, small batch: 7mil | |||
| 12~18 layers (including): sample: 6mil, small batch: 9mil | |||
| Copper thickness capacity | Inner layer: ≤60Z(≥50Z four-layers board, ≥40Z six-layers board, ≥30Z eight or more layers board; To be reviewed) | ||
| Surface copper thickness: ≤100Z(≥50Z; To be reviewed) | |||
| Copper thickness in hole: ≤50Z(≥1OZ; To be reviewed) | |||
| 4 | Reliability test | Peel strength | 7.8N/cm |
| Fire resistance | UL94V-0 | ||
| Ionic contamination | ≤1 (unit: pg / cm*) | ||
| Insulation thickness (minimum) | 0.05mm (only HOZ bottom copper) | ||
| Impedance tolerance | ±5Q(<50Ω), ±10%(≥50Q) If the value is exceeded, it shall be reviewed | ||
| 5 | Board | Common PCB substrate manufacturer | Sytech, IT EQ, KB |
| Halogen-free PCB manufacturer | Sytech, IT EQ, KB | ||
| Prepreg specification | 7628H、7628、2116、2113、1080、106 | ||
| Microwave and special materials | Rogers, Arlon, Taconic, Nelco, Taizhou Wangling | ||
| Aluminum substrate | Single-sided board / Double-sided board / Multilayer board (thermal conductivity 1-3W/m.K) | ||
| Copper substrate | Single-sided board | ||
| 6 | Special process | Blind hole plate | Conform to the structure of conventional blind hole plate, hole in hole (to be reviewed), cross blind hole (to be reviewed) |
| POFV (plate over filled via) process | |||
| Special-shaped hole / groove process | Counterbored hole, PTH (plating through hole), countersinking, depth-control hole, step slot, metal cladding, etc. | ||
| Impedance board | +/-10%(≤+/-5%; To be reviewed) | ||
| PTFE+FR 4 | |||
| FR4+ Microwave material + metal base | To be reviewed | ||
| Local electroplating thick gold process | Local electroplating thick gold: 40U"( To be reviewed) | ||
| Partial hybrid materials | FR4+ Local ceramic materials (To be reviewed) | ||
| Local pad protrusion process | To be reviewed | ||